PHOTOCURABLE ADHESIVE COMPOSITION

PROBLEM TO BE SOLVED: To obtain the above composition consisting essentially of an ethylene- vinyl acetate copolymer, capable of firmly bonding a metal to a metal plate or other material in good durability, excellent in transparency and weathering resistance and improved in heat resistance and resis...

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Bibliographic Details
Main Authors MORIMURA YASUHIRO, YOSHIDA TAKASHIGE, SASAKI KIYOMI, KOTSUBO HIDESHI
Format Patent
LanguageEnglish
Published 08.07.1997
Edition6
Subjects
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Summary:PROBLEM TO BE SOLVED: To obtain the above composition consisting essentially of an ethylene- vinyl acetate copolymer, capable of firmly bonding a metal to a metal plate or other material in good durability, excellent in transparency and weathering resistance and improved in heat resistance and resistance to moist heat. SOLUTION: This adhesive composition is obtained by adding 0.1-10 pts.wt. photosensitizer, 0.01-5 pts.wt. silane coupling agent and further 0.1-20 pts.wt. epoxy group-containing compound to 100 pts.wt. ethylene-vinyl acetate copolymer. A radical photopolymerization initiator is suitably used as the photosensitizer and the photosensitizer functions as a crosslinking agent (a curing agent) and forms a crosslinking structure in the composition when cured. The composition is effective as an adhesive in attaching a transparent film to a metal plate and does not impairs appearance of the metal plate, because the adhesive composition is colorless and transparent.
Bibliography:Application Number: JP19950351557