SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To provide a semiconductor device with reliability for a long time, by reducing shearing distortion caused at an end part of resin formed around a semiconductor element. SOLUTION: A semiconductor device 10 includes a circuit wiring board 2 and a semiconductor element 1 mounted...

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Bibliographic Details
Main Authors TATEYAMA KAZUKI, SAITO MASAYUKI, YAMADA HIROSHI, HONMA SOICHI, TOGASAKI TAKASHI
Format Patent
LanguageEnglish
Published 30.06.1997
Edition6
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:PROBLEM TO BE SOLVED: To provide a semiconductor device with reliability for a long time, by reducing shearing distortion caused at an end part of resin formed around a semiconductor element. SOLUTION: A semiconductor device 10 includes a circuit wiring board 2 and a semiconductor element 1 mounted on the board 2 with a bump electrode 3. A space between the board 2 and the semiconductor element 1 and a space around the semiconductor element 1 are sealed with a resin containing inorganic filler. The resin part includes a first resin 6 in a space surrounded with most outer bumps 3 in a circumferential part of the semiconductor element 1 and a second resin 7 in a space not surrounded with the most outer bumps 3. In addition, at least one index out of a containing ratio of inorganic filler, a maximum size of grain or a mean size of grain of the first resin 6 is made larger than that of the second resin 7.
Bibliography:Application Number: JP19950333323