MANUFACTURE OF MUTILAYERED WIRING BOARD

• Main Authors: TAKEMURA TOMOYUKI, ISODA SATOSHI
• Format: Patent
• Language: English
• Published: 20.06.1997
• Edition: 6
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

PROBLEM TO BE SOLVED: To form non-through holes in a short time and improve the adhesive strength between external conductors and an insulating layer by forming necessary internal-layer conductors by etching off the unnecessary part of copper foil from a copper-clad laminated board and an insulating layer on the internal- layer conductors except the parts where the non-through holes are to be formed. SOLUTION: After internal-layer conductors 2 are formed by etching off a copper-clad glass resin laminated board 1 in a prescribed pattern, non-through holes are formed in insulating layers 4. The insulating layers 4 are formed on the conductors 2 by the screen printing method except the parts where the non-through holes are to be formed and, at the same time, the non-through holes are formed. Therefore, the non-through holes can be formed in a short time, because no small-sized drill is required for forming the non-through holes and the inching operation of the drill which is hard to maintain necessary accuracy and not able to be performed efficiently is not required. In addition, the material of the insulating layer 4 can be selected out of such materials that can improve the adhesive strength between external conductors 11 and the layer 4, because no photosensitivity is required for the material.