SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To prevent failures such as cracks in a main case during fixation of a power module such as IGBT (semiconductor power device). SOLUTION: A main case 11 and a ring-shaped metal fitting 13 are molded in one piece by insert molding. The upper end of a lower ring-shaped part 13a of...

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Bibliographic Details
Main Author NAKAHIRA YOSHIKUNI
Format Patent
LanguageEnglish
Published 27.05.1997
Edition6
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:PROBLEM TO BE SOLVED: To prevent failures such as cracks in a main case during fixation of a power module such as IGBT (semiconductor power device). SOLUTION: A main case 11 and a ring-shaped metal fitting 13 are molded in one piece by insert molding. The upper end of a lower ring-shaped part 13a of the ring-shaped metal fitting 13 protrudes a little from the back of a screw hole 11b so that it may be in contact with a radiating plate 16. This prevents the stress caused by the tightening torque of the bolt from acting upon the main case 11 through the ring-shaped metal fitting 13 when the main case 11 is fixed to a radiator fin and makes the ring-shaped metal fitting 13 hardly be detached from the main case.
Bibliography:Application Number: JP19950296921