MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE

• Main Authors: NISHI KUNIHIKO, KANEDA AIZO, YOSHIDA ISAMU, SAEKI JUNICHI, TSUNODA SHIGEHARU
• Format: Patent
• Language: English
• Published: 06.05.1997
• Edition: 6
• Subjects: AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING; BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULARARTICLES; PERFORMING OPERATIONS; SEMICONDUCTOR DEVICES; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR; SHAPING OR JOINING OF PLASTICS; TRANSPORTING; WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

PROBLEM TO BE SOLVED: To provide a manufacturing method for a semiconductor device with which effective use of resin is realized and the pressure in a die channel is made uniform as much as possible, so that compatibility of productive efficiency of a resin mold with quality improvement of a product is realized. SOLUTION: In this method, a semiconductor chip 14 and a lead frame 13 are assigned between the first die (a female die) which is provided with a pot 2 shared by multiple cylinders 11 and an engagement structure, in which multiple gates 3 (5, 7), a fitting structure connected to the pot by fitted on at least one wall surface of the pot 2, separately transferring resin from the pot, and multiple cavities 4 (6, 8) supplied with the resin through the gates, are assigned, and the second die (an upper die) 10 wherein the multiple cylinders 11 are assigned on the position facing the pot surface of the first die with specified intervals, and, the resin is transferred to the each cavity 4 (6, 8) with a plunger 17 inserted into the cylinder after these both dies 1 and 10 are closed, for resin-molding each semiconductor chip.