THERMOSETTING RESIN COMPOSITION, ADHESIVE SHEET, AND METAL FOIL WITH ADHESIVE

• Main Authors: IKEDA KENICHI, TANAKA MASASHI, SUZUKI TAKAYUKI, TANABE TAKAHIRO, MURAI AKIRA
• Format: Patent
• Language: English
• Published: 15.04.1997
• Edition: 6
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; DYES; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ORGANIC MACROMOLECULAR COMPOUNDS; PAINTS; PERFORMING OPERATIONS; POLISHES; PRINTED CIRCUITS; THEIR PREPARATION OR CHEMICAL WORKING-UP; TRANSPORTING; USE OF MATERIALS AS ADHESIVES

PROBLEM TO BE SOLVED: To obtain a thermosetting resin composition that is excellent in ultraviolet absorbing action, heat resistance, etc., and is useful in producing a high- density printed circuit board, etc., by mixing a resin capable of forming a film, a light absorbing agent, and a polyfunctional epoxy resin. SOLUTION: (A) a resin capable of forming a film (e.g. a straight-chain epoxy type polymer), (B) a light absorbing agent, and (C) a polyfunctional epoxy resin (e.g. a bisphenol type epoxy resin) are mixed to obtain a thermosetting resin composition. As a preferable specific example of the component (A), can be mentioned a polymer obtained by polymerizing a bisphenol A type epoxy resin with hydroquinone with the equivalent ratio of the epoxy group/phenolic hydroxyl group being 1:(0.9 to 1.1). As a preferable specific example of the component (B), can be mentioned 1-(phenyl)-3-(4-tertiary-butylstyryl)-5-(4-tertiary- butylphenyl)-pyrazoline. The obtained thermosetting resin composition has such a feature that it can absorb 380 to 420nm ultraviolet light.