PRODUCTION OF THIN-FILM MAGNETIC HEAD
PURPOSE: To decrease the difference in the drafts within a substrate plane by disposing a substrate front surface opposite to a grinding surface plate and polishing this surface in the state of attracting a substrate back surface to a vacuum chuck surface and correcting and maintaining the warpage o...
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Main Author | |
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Format | Patent |
Language | English |
Published |
12.04.1996
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Edition | 6 |
Subjects | |
Online Access | Get full text |
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Summary: | PURPOSE: To decrease the difference in the drafts within a substrate plane by disposing a substrate front surface opposite to a grinding surface plate and polishing this surface in the state of attracting a substrate back surface to a vacuum chuck surface and correcting and maintaining the warpage of the substrate. CONSTITUTION: When, for example, a substrate 9 is chucked at its back surface 8 to a vacuum chuck 4 having flatness of 0.3μm, the substrate warps is in convex state of 3μm. A vacuum pump is connected via a rotatable joint to the central part of the vacuum chuck 4. The substrate is placed on the grinding surface plate 6 of a grinding device 5 while the substrate is held sucked to the vacuum chuck. The substrate is then subjected to grinding under a vacuum pressure of -500mmHg. A grinding device of a type to hold and rotate the work by means of a guide roller 14 is used for the grinding device 5. At this time, the grinding surface plate 6 of soft metal tin executes grinding by using a diamond slurry of an average grain size of 1μm for grinding fluid 18. The substrate 9 is chucked by the vacuum chuck 4 in such a manner and is subjected to grinding in the state of correcting the substrate warpage, thereby, the value of the difference in the warpage between the front surface and the back surface of the substrate 9 is decreased. |
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Bibliography: | Application Number: JP19940232781 |