SEMICONDUCTOR DEVICE

PURPOSE: To improve the heat dissipation efficiency and the maintainability in a semiconductor device adapted to be used for a so-called multi-chip module in which a semiconductor chip is placed on the upper part of a circuit board. CONSTITUTION: The semiconductor device comprises a circuit board 4...

Full description

Saved in:
Bibliographic Details
Main Authors OKI KENICHI, MURATAKE KIYOSHI
Format Patent
LanguageEnglish
Published 02.04.1996
Edition6
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Online AccessGet full text

Cover

More Information
Summary:PURPOSE: To improve the heat dissipation efficiency and the maintainability in a semiconductor device adapted to be used for a so-called multi-chip module in which a semiconductor chip is placed on the upper part of a circuit board. CONSTITUTION: The semiconductor device comprises a circuit board 4 placed with a semiconductor chip 3 on the upper surface and formed with external connection pins 23 on the lower surface, a cap 5 formed integrally with a heat radiating fin part 12 and made of high heat conductive material for sealing the chip 3 by arranging on the upper surface of the board 4, a base member 6 engaged with the lower surface of the board 4, and a clamping mechanism 8 for fixing the cap 5 to the member 6. The cap 5 is brought into direct contact with the chip 3, and the cap 5 and the member 6 sandwich the board 4 thereby to seal the chip 3.
Bibliography:Application Number: JP19940223810