DEVICE FOR SUPPLYING MINUTE AMOUNT OF LIQUID MATERIAL AND PATTERN CORRECTING METHOD USING THE SAME

• Main Authors: IMATAKE MITSUKO, KATAYAMA KAORU, MIYAUCHI TAKEOKI, MATSUZAKI HIDEO, MARUYAMA SHIGENOBU, HONGO MIKIO, SAKAMOTO HARUHISA, MIZUKOSHI KATSURO, MIYATA KAZUFUMI
• Format: Patent
• Language: English
• Published: 12.03.1996
• Edition: 6
• Subjects: APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL; APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL; BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PERFORMING OPERATIONS; PRINTED CIRCUITS; PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL; SEMICONDUCTOR DEVICES; SPRAYING OR ATOMISING IN GENERAL; TRANSPORTING

PURPOSE: To provide a device capable of supplying a minute amt. of the liq. material consisting of a highly volatile component such as resist varnish and a highly viscous or caking component without causing clogging at the tip of a pipet and the wetting of the tip of the pipet with the material. CONSTITUTION: This device consists of a hollow pipet 1 with the tip contracted, a driving mechanism 2 to coarsely or finely move the pipet 1, a mechanism 3 to apply a pulsed gas pressure on the pipet 1, an observation system 4 to monitor a liq. material feed part and a means 10 to fill the space around the pipet 1 with an atmosphere contg. the vapor of the volatile component contained in a liq. material 5, and a film to prevent the wetting with the liq. material 5 is formed on at least the tip of the pipet 1 and the outer surface close to the tip. The liq. material 5 contg. a highly volatile component such as resist varnish filled in the pipet 1 is optionally supplied in a specified amt. to the pattern-deficient part of a substrate 7 to correct the pattern.