PRODUCTION OF PHOTOSENSITIVE RESIN COMPOSITION AND PATTERN

PURPOSE:To produce a photosensitive resin composition capable of obtaining a coated film uniform in film thickness without a secular change of varnish. CONSTITUTION:In this composition, (a) 100 pts.wt. polymer consisting essentially of a repeating unit expressed by formula I (where the formula, R is...

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Bibliographic Details
Main Authors KAWASAKI MASARU, KOJIMA MITSUMASA
Format Patent
LanguageEnglish
Published 16.02.1996
Edition6
Subjects
APPARATUS SPECIALLY ADAPTED THEREFOR
BASIC ELECTRIC ELEMENTS
CINEMATOGRAPHY
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
ELECTROGRAPHY
HOLOGRAPHY
MATERIALS THEREFOR
ORIGINALS THEREFOR
PHOTOGRAPHY
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES
PHYSICS
SEMICONDUCTOR DEVICES
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Summary:PURPOSE:To produce a photosensitive resin composition capable of obtaining a coated film uniform in film thickness without a secular change of varnish. CONSTITUTION:In this composition, (a) 100 pts.wt. polymer consisting essentially of a repeating unit expressed by formula I (where the formula, R is tervalent or quadrivalent org. group, R is divalent org. group, M is alkali metal ion or ammonium ion. (n) is 1 or 2.), (b) 0. 1-100 pts.wt. bisazido compd. expressed by formula II (where, the formula, R is divalent org. group.), (c) 1-400 pts.wt. amine compd. having an unsatd. bond and (d) a compd. having carboxyl group in a molecule are incorporated.
Bibliography:Application Number: JP19940176276