ELECTRONIC CIRCUIT DEVICE

PURPOSE:To secure the height of a bump by a method wherein the bump is composed of the first metal, which is fused at a mounting temperature, and the second metal having a melting point higher than that of the first metal. CONSTITUTION:A bump 9, which connects the pad electrode 3 of a wiring substra...

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Main Authors SAITO MASAYUKI, KIZAKI YUKIO, MORI MIKI, EBITANI TAKASHI, SHIMIZU SEISABURO, UCHIDA TATSUAKI, TOGASAKI TAKASHI
Format Patent
LanguageEnglish
Published 06.02.1996
Edition6
Subjects
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
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Summary:PURPOSE:To secure the height of a bump by a method wherein the bump is composed of the first metal, which is fused at a mounting temperature, and the second metal having a melting point higher than that of the first metal. CONSTITUTION:A bump 9, which connects the pad electrode 3 of a wiring substrate 2 and the pad electrode 5 of a circuit part 4, is composed of the first low melting point metal layer 6, a high melting point metal layer 7 which as a core, and the second low melting point metal layer 8. Besides, the second low melting point metal layer 8 may be composed of the material different from the first low melting point metal layer 6, and the material which is fused at mounting temperature is used. Moreover, the thickness of the high melting point metal layer 7 in the bump is made thinner than the thickness of other part. Also, the cross section of the high melting point metal layer 7 is made smaller than the cross section of the pad electrodes 3 and 5. As a result, a highly reliable electronic circuit device can be obtained easily.
Bibliography:Application Number: JP19940171320