SEMICONDUCTOR LASER DIODE AND MANUFACTURE THEREOF

PURPOSE: To provide a semiconductor laser diode, which is low in cost, reduces the number of assembly processes and also is easily automatized and can monitor accurately, and a method of manufacturing the laser diode. CONSTITUTION: A lead frame 11 is provided with a first mounting lead 11a to be mou...

Full description

Saved in:
Bibliographic Details
Main Author MACHIDA SHOICHI
Format Patent
LanguageEnglish
Published 24.12.1996
Edition6
Subjects
BASIC ELECTRIC ELEMENTS
DEVICES USING STIMULATED EMISSION
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Online AccessGet full text

Cover

More Information
Summary:PURPOSE: To provide a semiconductor laser diode, which is low in cost, reduces the number of assembly processes and also is easily automatized and can monitor accurately, and a method of manufacturing the laser diode. CONSTITUTION: A lead frame 11 is provided with a first mounting lead 11a to be mounted with a laser diode 12 and a second mounting lead 11b to be mounted with a monitor photodiode 13 and the mounting lead on one side of the mounting leads 11a and 11b is formed with a bending leas 11c, which bends the diode 12 or the diode 13 at roughly a right angle toward the side of the diode 13 or the diode 12. The lead 11a or the lead 11b is bent at roughly a right angle at the part of the lead 11c and the diode 13 is turned in the direction the back ward output of the diode 12 is output and a resin molding is performed using the surface of the lead frame 11 as a parting surface.
Bibliography:Application Number: JP19950171501