LEAD FRAME AND ITS MANUFACTURE

PURPOSE:To constitute the sectional form of the bonding area of an inner lead after coining process, as a form wherein imperfect bonding is not generated and bonding position precision is not deteriorated. CONSTITUTION:In the bonding area of an inner lead, a half etching part A is formed, and the se...

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Bibliographic Details
Main Authors FUJIWARA TATSUO, ONO ETSUKO
Format Patent
LanguageEnglish
Published 02.02.1996
Edition6
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:PURPOSE:To constitute the sectional form of the bonding area of an inner lead after coining process, as a form wherein imperfect bonding is not generated and bonding position precision is not deteriorated. CONSTITUTION:In the bonding area of an inner lead, a half etching part A is formed, and the sectional form is constituted in an approximate rectangle by coining the half etching part.
Bibliography:Application Number: JP19940183963