MARK POSITION DETECTING METHOD, SEMICONDUCTOR WAFER USED THEREFOR, AND METHOD AND APPARATUS FOR DETECTING FOREIGN MATTER

PURPOSE: To provide a mark position detecting method capable of detecting the position of a detected object or a foreign matter irrespective of the outer shape of a semiconductor wafer, a semiconductor wafer used therefor, and a foreign matter detecting method and a device by the use thereof. CONSTI...

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Bibliographic Details
Main Authors SUGIMOTO ARITOSHI, MOTOMURA NAOYUKI, NOZOE MARI
Format Patent
LanguageEnglish
Published 01.10.1996
Edition6
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:PURPOSE: To provide a mark position detecting method capable of detecting the position of a detected object or a foreign matter irrespective of the outer shape of a semiconductor wafer, a semiconductor wafer used therefor, and a foreign matter detecting method and a device by the use thereof. CONSTITUTION: A dummy wafer is provided with two marks, a first mark 3 and a second mark 4, separate from each other and located on the peripheral part of its front 1a or rear 1c, wherein the front 1a or the rear 1c is mirror- finished, or a film is formed on the front 1a or the rear 1c through a CVD process. A foreign matter 2 or a detected object attached to the front 1a or the rear is detected by a dummy wafer.
Bibliography:Application Number: JP19950059197