PRODUCTION OF OPTICAL PARTS COMPRISING RUTILE SINGLE CRYSTAL
PURPOSE: To obtain such a production method that when a single crystal chip is cut from a single crystal ingot, appearance defects such as cracks and chipping are hardly caused and that when lots of single crystal chips are subjected to mirror finishing on a lapping table at one time, chips can be u...
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Main Authors | , |
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Format | Patent |
Language | English |
Published |
30.08.1996
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Edition | 6 |
Subjects | |
Online Access | Get full text |
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Abstract | PURPOSE: To obtain such a production method that when a single crystal chip is cut from a single crystal ingot, appearance defects such as cracks and chipping are hardly caused and that when lots of single crystal chips are subjected to mirror finishing on a lapping table at one time, chips can be uniformly, efficiently and accurately processed. CONSTITUTION: By this method, rutile single crystal optical parts having the optical axis parallel to the processed plane are produced. A rutile single crystal ingot 20 is sliced in the direction crossing the optical plane to obtain wafers 22, 23, from which lots of single crystal chips 24, 25 are segmented in such a manner that the optical plane of each chip is (110) plane. The obtd. single crystal chips are arranged and fixed on a surface plate with the (110) planes of the chips are aligned and then subjected to mirror finishing. |
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AbstractList | PURPOSE: To obtain such a production method that when a single crystal chip is cut from a single crystal ingot, appearance defects such as cracks and chipping are hardly caused and that when lots of single crystal chips are subjected to mirror finishing on a lapping table at one time, chips can be uniformly, efficiently and accurately processed. CONSTITUTION: By this method, rutile single crystal optical parts having the optical axis parallel to the processed plane are produced. A rutile single crystal ingot 20 is sliced in the direction crossing the optical plane to obtain wafers 22, 23, from which lots of single crystal chips 24, 25 are segmented in such a manner that the optical plane of each chip is (110) plane. The obtd. single crystal chips are arranged and fixed on a surface plate with the (110) planes of the chips are aligned and then subjected to mirror finishing. |
Author | INAGAKI TOSHIMITSU TAKAHASHI AKIO |
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Edition | 6 |
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Notes | Application Number: JP19950050650 |
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PublicationDate | 19960830 |
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PublicationDecade | 1990 |
PublicationYear | 1996 |
RelatedCompanies | FUJI ELELCTROCHEM CO LTD |
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Snippet | PURPOSE: To obtain such a production method that when a single crystal chip is cut from a single crystal ingot, appearance defects such as cracks and chipping... |
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SubjectTerms | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS OPTICS PHYSICS SEMICONDUCTOR DEVICES |
Title | PRODUCTION OF OPTICAL PARTS COMPRISING RUTILE SINGLE CRYSTAL |
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