PRODUCTION OF OPTICAL PARTS COMPRISING RUTILE SINGLE CRYSTAL

PURPOSE: To obtain such a production method that when a single crystal chip is cut from a single crystal ingot, appearance defects such as cracks and chipping are hardly caused and that when lots of single crystal chips are subjected to mirror finishing on a lapping table at one time, chips can be u...

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Bibliographic Details
Main Authors INAGAKI TOSHIMITSU, TAKAHASHI AKIO
Format Patent
LanguageEnglish
Published 30.08.1996
Edition6
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
OPTICS
PHYSICS
SEMICONDUCTOR DEVICES
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Summary:PURPOSE: To obtain such a production method that when a single crystal chip is cut from a single crystal ingot, appearance defects such as cracks and chipping are hardly caused and that when lots of single crystal chips are subjected to mirror finishing on a lapping table at one time, chips can be uniformly, efficiently and accurately processed. CONSTITUTION: By this method, rutile single crystal optical parts having the optical axis parallel to the processed plane are produced. A rutile single crystal ingot 20 is sliced in the direction crossing the optical plane to obtain wafers 22, 23, from which lots of single crystal chips 24, 25 are segmented in such a manner that the optical plane of each chip is (110) plane. The obtd. single crystal chips are arranged and fixed on a surface plate with the (110) planes of the chips are aligned and then subjected to mirror finishing.
Bibliography:Application Number: JP19950050650