SOLDERING METHOD OF SILICON ELEMENT
PROBLEM TO BE SOLVED: To enable solder-bumping bonding pads of individual semiconductor chips at a low cost, by depositing solder paste in a pattern on a heat resistance surface which is not wetted by solder, arranging a chip on the paste, and forming fused solder by re-fluidizing the paste. SOLUTIO...
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Main Authors | , , |
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Format | Patent |
Language | English |
Published |
20.08.1996
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Edition | 6 |
Subjects | |
Online Access | Get full text |
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