SOLDERING METHOD OF SILICON ELEMENT

• Main Authors: INON DEGANI, TOOMASU DEIKUSON DATSUDERAA, JIYON JIERAADO SUPADAFUORA
• Format: Patent
• Language: English
• Published: 20.08.1996
• Edition: 6
• Subjects: BASIC ELECTRIC ELEMENTS; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR; PERFORMING OPERATIONS; SEMICONDUCTOR DEVICES; SOLDERING OR UNSOLDERING; TRANSPORTING; WELDING; WORKING BY LASER BEAM

PROBLEM TO BE SOLVED: To enable solder-bumping bonding pads of individual semiconductor chips at a low cost, by depositing solder paste in a pattern on a heat resistance surface which is not wetted by solder, arranging a chip on the paste, and forming fused solder by re-fluidizing the paste. SOLUTION: A heat resistance surface 24 which is capable of solder paste printing but not wetted by solder is prepared. A pattern 36 of solder paste is printed on the heat resistance surface 24 which is not wetted by solder, according to the pattern of a junction region 18 on a semiconductor chip 12'. The chip 12' is so arranged on the surface 24 that the bonding pad 18 on the chip 12' comes into contact with a part of the pattern 36 of the solder paste. The pattern 36 of solder paste is re-fluidized, and fused solder is formed. The boding pad 18 of the chip 12' is wetted by the fused solder, which is joined to the bonding pad 18. After the fused solder is cooled, the chip 12' is detached from the surface 24.