BOARD FOR SEMICONDUCTOR DEVICE

PURPOSE: To improve heat dissipation properties through thinning of a board itself by adding zirconia to principal component of alumina and then adding one kind or more of additive, selected from a group of yttria, calcia, magnesia and ceria, thereto thereby preparing sintered ceramic having enhance...

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Bibliographic Details
Main Authors MIYAMA HIROSHI, OOIWA SEIGO, SAITO SHIGEMASA, MOROZUMI AKIRA, NISHIURA SHINJI, NOZAKI TOSHIO
Format Patent
LanguageEnglish
Published 30.07.1996
Edition6
Subjects
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Summary:PURPOSE: To improve heat dissipation properties through thinning of a board itself by adding zirconia to principal component of alumina and then adding one kind or more of additive, selected from a group of yttria, calcia, magnesia and ceria, thereto thereby preparing sintered ceramic having enhanced fracture toughness. CONSTITUTION: A ceramic board 2a is laminated on a heat dissipation base through adhesive or the like while being sandwiched by copper plates 2b, 2c thus constituting a CBC board 2. The ceramic board 2a in the CBC board 2 is produced by adding zirconia to principal component of alumina and then further adding one kind or more of additive selected from a group of yttria, calcia, magnesia and ceria thereby preparing a sintered cerarnic. Since the bending strength of the CBC board 2 is enhanced and the flexure thereof is increased, it can be made thin without causing any crack and the thermal conductivity can be enhanced geometrically.
Bibliography:Application Number: JP19950006103