SEMICONDUCTOR MODULE

PURPOSE: To make an equal amount of current flow through three semiconductor elements even in the case where the three semiconductor elements are mounted in a module. CONSTITUTION: Three diode elements 101, 102 and 103 are provided on a cathode side conductor pattern 104. The region lying across on...

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Bibliographic Details
Main Authors KOIKE YOSHIHIKO, KOKUBU HIDEYA, SEKINE SHIGEKI, SAITO RYUICHI, KOIKE SHINYA
Format Patent
LanguageEnglish
Published 23.07.1996
Edition6
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:PURPOSE: To make an equal amount of current flow through three semiconductor elements even in the case where the three semiconductor elements are mounted in a module. CONSTITUTION: Three diode elements 101, 102 and 103 are provided on a cathode side conductor pattern 104. The region lying across on the center line 116 of an insulating substrate 106 on an anode side conductor pattern 105 is used as the bonding region 203 of an anode side connection terminal. A conductor pattern 105 between this region 203 and the middle second diode element 102 is notched and a current bypass part 105a is formed on this pattern 105. A current path on the element 102 becomes longer by the formation of the bypass part 105a and becomes equal with current path lengths on the other elements 101 and 103. As a result, an equal amount of current flows through the elements 101, 102 and 103.
Bibliography:Application Number: JP19950002818