MULTI-LAYER PRINTED WIRING BOARD

PURPOSE:To provide a multi-layer printed wiring board which can easily and without error distribute discrepancy of shrinkage even when the shrinkage is limited to a prescribed width according to thermal shrinkage. CONSTITUTION:This relates to a laminate 2 in which an inner conductor pattern is forme...

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Bibliographic Details
Main Author YAMAGUCHI CHIHIRO
Format Patent
LanguageEnglish
Published 19.01.1996
Edition6
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Summary:PURPOSE:To provide a multi-layer printed wiring board which can easily and without error distribute discrepancy of shrinkage even when the shrinkage is limited to a prescribed width according to thermal shrinkage. CONSTITUTION:This relates to a laminate 2 in which an inner conductor pattern is formed on at least one side of the surfaces of a substrate having a thermal shrinkage of a prescribed width, an insulating resin layer, arranged as if to hold the laminate 2, and formed by thermocompression bonding of a substrate impregnated a thermosetting polyer, and a multi-layer wiring board provided with an outer conductor pattern formed on the outer surface of the insulating resin layer. On the sides of both ends of the laminate 2, there are reference marks 5' and 5'' of plural pairs having different spaces between the reference marks, which are provided to correspond to the shrinkage of the laminate 2, and the reference marks 5' and 5'' are arranged at positions where lines connecting reference marks of each pair are parallel to each other and the difference between other reference marks 5' and 5'' are distributed equally to both sides in reference to other reference marks.
Bibliography:Application Number: JP19940147416