METHOD FOR REMOVING FOREIGN OBJECT ATTACHED TO SEMICONDUCTOR WAFER

PURPOSE: To enable a foreign object removing operation where an adhesive tape is used to be simplified and enhanced in removal rate when foreign objects attached to both sides of the semiconductor substrate are removed. CONSTITUTION: A set of adhesive tapes 1A and 1B each composed of a support film...

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Bibliographic Details
Main Authors MIKI KAZUYUKI, CHIKADA YASU
Format Patent
LanguageEnglish
Published 07.06.1996
Edition6
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:PURPOSE: To enable a foreign object removing operation where an adhesive tape is used to be simplified and enhanced in removal rate when foreign objects attached to both sides of the semiconductor substrate are removed. CONSTITUTION: A set of adhesive tapes 1A and 1B each composed of a support film 11 and an adhesive agent layer 12 continuously provided onto the support film 11 in a lengthwise direction and of nearly the same shape with the a semiconductor wafer 2 are pasted on both the sides of the semiconductor wafers 2 sandwiching them in between the tapes 1A and 1B so as to make the adhesive agent layers 12 confront the front and rear of the semiconductor wafers 2, and then the tapes 1A and 1B are continuously separated off from the semiconductor wafers 2 at the same time, whereby foreign objects 3 attached to the front and rear of the semiconductor wafers 2 are removed by being adsorbed to the adhesive agent layer 12.
Bibliography:Application Number: JP19940309805