WASHING METHOD OF SILICON SLUDGE OF SEMICONDUCTOR WAFER

• Main Authors: SEKIDA SABURO, KAWASHIMA ISAMU
• Format: Patent
• Language: English
• Published: 07.06.1996
• Edition: 6
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

PURPOSE: To obtain a washing method in which the adhesion of silicon sludge to a ground semiconductor wafer can be prevented and also the stain, the trace and the cloud and the like of solution are not left by a method wherein a semiconductor wafer rotating process and the brush-washing process of the secondary drying process are combindly and simultaneously used immediately after the first drying process. CONSTITUTION: In the first drying process, a semiconductor wafer W is dried up by discharging low pressure dry air to the semiconductor wafer by operating a dry air discharging means 9. In a semiconductor wafer rotating process, the semiconductor wafer is rotated by operating a rotating shaft 2 and a rotating means 3. In the second drying process, the semiconductor wafer W is dried up by discharging high pressure dry air to the semiconductor wafer W by operating a dry air discharging means 9. In a brush washing process, a pair of upper and lower brushes 5 are rotated by operating a brush rotating means 6, and the rotating brushes 5 are advanced or retreated by operating a brush advancing/retreating means 7. At this point, the semiconductor wafer rotating process, the second drying process and the brush washing process are combindly used immediately after the first drying process.