SEMICONDUCTOR DEVICE AND ITS MANUFACTURE

PURPOSE: To reduce cost and improve reliability and electric characteristics, with respect to a semiconductor device in which an external terminal section is arrayed in a lattice-like form on a plane and its manufacture. CONSTITUTION: A package 22 is constituted a resin region 23 which seals a semic...

Full description

Saved in:
Bibliographic Details
Main Authors ORIMO MASAICHI, YONEDA YOSHIYUKI, SAKOTA EIJI, TSUJI KAZUTO, NOMOTO TAKASHI, KASAI JUNICHI, WATANABE EIJI, ONODERA MASANORI
Format Patent
LanguageEnglish
Published 07.05.1996
Edition6
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Online AccessGet full text

Cover

More Information
Summary:PURPOSE: To reduce cost and improve reliability and electric characteristics, with respect to a semiconductor device in which an external terminal section is arrayed in a lattice-like form on a plane and its manufacture. CONSTITUTION: A package 22 is constituted a resin region 23 which seals a semiconductor chip 41, a terminal region 24 which a pattern section 25 having a pattern layer 32 bonded with a wire 43 mounting the semiconductor chip 41 is connected to an external terminal 26 in which a frame-like terminal section 27 and a columnar terminal section 28 are formed.
Bibliography:Application Number: JP19950050054