TRANSFERRING MECHANISM AND METHOD FOR SEMICONDUCTOR WAFER

• Main Author: SEKIDA SABURO
• Format: Patent
• Language: English
• Published: 31.03.1995
• Edition: 6
• Subjects: BASIC ELECTRIC ELEMENTS; CONVEYING; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; HANDLING THIN OR FILAMENTARY MATERIAL; PACKING; PERFORMING OPERATIONS; PNEUMATIC TUBE CONVEYORS; SEMICONDUCTOR DEVICES; SHOP CONVEYOR SYSTEMS; STORING; TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING ORTIPPING; TRANSPORTING

PURPOSE:To transfer a semiconductor wafer to a storing cassette without touching the processed surface of the wafer by a method wherein fluid is spouted out from 21 jet nozzle located below a base so as to keep a semiconductor wafer in a floating state, and then the floating semiconductor wafer is transferred by extending a pushing device. CONSTITUTION:The base 1 of a transfer mechanism is formed of porous member. A fluid jetting nozzle 4 connected to a fluid spouting equipment is provided below the bottom 2 of the base 1. A pushing device 5 freely movable back or forth is provided in parallel with the upside of the bottom 2 of the base 1, and the tip of the pushing device 5 is formed into a curvature 5a conforming to the periphery of a semiconductor wafer W. Fluid is spouted out upwards from the fluid jetting nozzle 4 located below the base 1 so as to keep the semiconductor wafer W in a floating state, and then the floating semiconductor wafer W is transferred. By this setup, a semiconductor wafer W can be transferred to a storing cassette without touching its processed surface, so that the wafers W can be remarkably enhanced in processing yield.