PACKAGING METHOD FOR SEMICONDUCTOR CHIP

PURPOSE:To realize the cost cutting by a method wherein highly reliable packaged products are manufactured in a simple process by flip chip bonding technology using solder bumps. CONSTITUTION:This packaging method of semiconductor chip is composed of the following two steps, i.e., the first step of...

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Bibliographic Details
Main Author RAI AKITERU
Format Patent
LanguageEnglish
Published 20.03.1995
Edition6
Subjects
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
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Summary:PURPOSE:To realize the cost cutting by a method wherein highly reliable packaged products are manufactured in a simple process by flip chip bonding technology using solder bumps. CONSTITUTION:This packaging method of semiconductor chip is composed of the following two steps, i.e., the first step of transferring a flux 7 on the front ends of solder bumps 3 formed on a chip 1 as the flux coating method in the flip chip bonding process and the second step of later flip chip bonding this chip 1 on a substrate 5 thereby enabling the flux cleaning up step to be eliminated.
Bibliography:Application Number: JP19930224105