ALIGNING METHOD, ALIGNER AND ALIGNING SYSTEM

PURPOSE:To form a highly accurate thin film pattern on a ceramic substrate by calculating the quantity of correcting an aligning focal point based on 1st and 2nd measured values and aligning after setting an aligning focus on a position including the correction quantity. CONSTITUTION:The system is c...

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Bibliographic Details
Main Authors INOUE TAKASHI, YOSHIMOTO MITSUO, SUGANO KENICHI, YAMAZAKI TETSUYA, MIURA SHINYA, MATSUYAMA HARUHIKO
Format Patent
LanguageEnglish
Published 20.03.1995
Edition6
Subjects
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Summary:PURPOSE:To form a highly accurate thin film pattern on a ceramic substrate by calculating the quantity of correcting an aligning focal point based on 1st and 2nd measured values and aligning after setting an aligning focus on a position including the correction quantity. CONSTITUTION:The system is constituted of a flatness measuring machine 1 for measuring a three-dimensional coordinate from a reference point on an optional point of the ceramic and transferring data to an arithmetic processing and storing device 2, an arithmetic processing and storing device 2 for storing the data transmitted from the flatness measuring machine 1 and an aligner 3, executing a calculation processing and transferring the data to the aligner 3 and the aligner 3. By such a constitution, the flatness of a desired point on the substrate is measured, and the 1st measured value is stored, the flatness on a part of the desired point on the substrate in the aligning position is measured so as to obtain the 2nd measured value, then, the quantity of correcting the aligning focal position is calculated based on the 1st and 2nd measured values, the aligning focus is set on the position including the correction quantity, thereafter, the alignment is executed.
Bibliography:Application Number: JP19930225410