PHOTOSENSITIVE RESIN COMPOSITION AND ITS HARDENED PRODUCT AND IMAGE FORMING MATERIAL

PURPOSE:To reduce hardening shrinkage and to enhance hardness, heat resistance to soldering, transparency, adhesiveness, resistances to acid, alkali, and solvents, and insulation resistance by adding a specified spiro-orthoester to the constituent elements of the composition. CONSTITUTION:This photo...

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Bibliographic Details
Main Authors FURUKAWA MASAYA, TERAMOTO TAKEO, WATABE KAZUHIRO, FUJISHIRO KOICHI
Format Patent
LanguageEnglish
Published 10.03.1995
Edition6
Subjects
APPARATUS SPECIALLY ADAPTED THEREFOR
CALCULATING
CINEMATOGRAPHY
COMPUTING
COUNTING
ELECTRIC DIGITAL DATA PROCESSING
ELECTROGRAPHY
HOLOGRAPHY
MATERIALS THEREFOR
OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
OPTICS
ORIGINALS THEREFOR
PHOTOGRAPHY
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES
PHYSICS
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Summary:PURPOSE:To reduce hardening shrinkage and to enhance hardness, heat resistance to soldering, transparency, adhesiveness, resistances to acid, alkali, and solvents, and insulation resistance by adding a specified spiro-orthoester to the constituent elements of the composition. CONSTITUTION:This photosensitive resin composition contains 100 pts.wt. of a photopolymerizable compound having an ethylenically unsaturated double bond and a carboxylic group, 0.1-30 pts.wt. of a photopolymerization initiator, 0.1-30 pts.wt. of a sensitizer, and 5-100 pts.wt. of the spiro-orthoester compound having in the molecule >=2 spiro-orthoester groups represented by the formula in which p is an integer of 3-5. The spiro-orthoester to be used is prepared by reaction of a lactone, such as gamma-butyrolactone, delta-valerolactone, or epsilon- caprolactone, with an epoxy compound.
Bibliography:Application Number: JP19930214292