SURFACE TREATING APPARATUS

• Main Authors: ONO TETSUO, YOKOGAWA KATANOBU
• Format: Patent
• Language: English
• Published: 03.03.1995
• Edition: 6
• Subjects: BASIC ELECTRIC ELEMENTS; CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES; MEASURING; METALLURGY; PHYSICS; SEMICONDUCTOR DEVICES; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; TESTING

PURPOSE:To provide a surface treating apparatus, which can uniformly supply reactive particles jetted through a thin nozzle on the entire surface of a sample substrate to be machined and can uniformly machine the entire surface of the sample to be machined as a result. CONSTITUTION:A means 6, which rotates a sample to be machined 3, a means 8, which scans the nozzle 7 on the central line of the rotating sample to be machined 3, and a means 10, which controls the scanning speed of the nozzle 7 in proportion to the distance from the center of the rotating sample to be machined 3, are provided.