EPOXYACRYLATE RESIN

PURPOSE:To obtain the resin suitable for an insulating film for multilayer formation, solder resist, etc., having excellent heat resistance, solvent solubility and sensitizing properties, comprising a specific chemical structure. CONSTITUTION:This epoxyacrylate resin is shown by formula I (R is H or...

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Bibliographic Details
Main Authors TERAMOTO TAKEO, WATABE KAZUHIRO
Format Patent
LanguageEnglish
Published 21.02.1995
Edition6
Subjects
CHEMISTRY
COMPOSITIONS BASED THEREON
MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS
MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
METALLURGY
ORGANIC MACROMOLECULAR COMPOUNDS
THEIR PREPARATION OR CHEMICAL WORKING-UP
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Summary:PURPOSE:To obtain the resin suitable for an insulating film for multilayer formation, solder resist, etc., having excellent heat resistance, solvent solubility and sensitizing properties, comprising a specific chemical structure. CONSTITUTION:This epoxyacrylate resin is shown by formula I (R is H or lower alkyl; R' is H or CH3; (n) is 0-20). The resin, for example, is obtained by dissolving an epoxy resin of formula II in ethyl Cellosolve acetate, etc., and reacting with (meth)acrylic acid in the presence of a catalyst such as 2- ethyl-4-imidazole.
Bibliography:Application Number: JP19940083767