SEMICONDUCTOR DEVICE WITH PAD FOR CIRCUIT INSPECTION

PURPOSE:To provide an inspection pad that occupies no space on an IC chip, and capable of eliminating a parasitic factor when the test pad is used for a high-frequency IC. CONSTITUTION:An inspection pad 181 is formed on a scribing line 191. The inspection pad 181 on the scribing line 191 has a shape...

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Bibliographic Details
Main Authors SAKAI HIROYUKI, MORIMOTO SHIGERU
Format Patent
LanguageEnglish
Published 07.02.1995
Edition6
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MEASURING
MEASURING ELECTRIC VARIABLES
MEASURING MAGNETIC VARIABLES
PHYSICS
SEMICONDUCTOR DEVICES
TESTING
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Summary:PURPOSE:To provide an inspection pad that occupies no space on an IC chip, and capable of eliminating a parasitic factor when the test pad is used for a high-frequency IC. CONSTITUTION:An inspection pad 181 is formed on a scribing line 191. The inspection pad 181 on the scribing line 191 has a shape like a lozenge. The inspection pad 181 on the scribing line 191 is removed when an IC is cut off in a scribing step. When this technique is applied to a high-frequency IC, a parasitic factor caused by the inspection pad 181 can be eliminated. Since the inspection pad 181 occupies no space on the IC, high integration can be realized.
Bibliography:Application Number: JP19930179007