ELECTRONIC COMPONENT AND MODULE STRUCTURE THEREOF

• Main Authors: OMURA HIDEKAZU, NOZAKI YUTAKA, NAKAMURA SHINJI, SUGIMOTO SHUICHI
• Format: Patent
• Language: English
• Published: 07.02.1995
• Edition: 6
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

PURPOSE:To let the falling-off or deformation of electrode patterns for mounting electronic components hardly happen and to prevent electronic components and wirings from being shorted and then to avoid corrosion of the wirings even when the wirings run under the electronic components. CONSTITUTION:A plurality of leads 4a, 4b, 15 come from a molded section 9 wherein a semiconductor chip is sealed with molding resin 7. Near electrode patterns 5a, 5b for mounting electronic component elements, a space between the electronic patterns 5a and 5b is filled with the same molding resin 7 as used in the molded section 9 and all the part of the lead 15 except for the electrode patterns 5a, 5b is covered with the molding resin 7. Therefore, when a chip-like electronic component element is mounted between the electrode patterns 5a and 5b, the electronic component element and the lead 15 located under the element are insulated from each other with the molding resin 7 covering the lead 15.