INSPECTING JIG FOR ELECTRIC CHARACTERISTIC OF SEMICONDUCTOR DEVICE

• Main Authors: KAWAGUCHI YASUMASA, MIZUNO CHIYOUICHIROU
• Format: Patent
• Language: English
• Published: 07.02.1995
• Edition: 6
• Subjects: MEASURING; MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES; PHYSICS; TESTING

PURPOSE:To provide an inspecting jig which can securely inspect electric characteristics of an unpackaged semiconductor device without damaging the semiconductor device. CONSTITUTION:An inspecting jig includes a guide 10 for covering a face 5a of a semiconductor device 5 where solder ball electrodes 50 are provided and a plurality of fine needle electrodes 20 which can be in electrical contact with the plurality of solder ball electrodes 50, respectively, wherein at each portion corresponding to the solder ball electrode 50 of the guide 10, the fine needle electrode 20 is provided through a guide hole 15 where insertion is possible. The fine needle electrode 20 has an elastic part 21 which can buffer pressing force of the fine needle electrode 20 against the solder ball electrode 50. Therefore, only by inserting the fine needle electrode 20 into the guide hole 15, the electrode 20 can be securely brought into contact with the solder ball electrode 50, thereby securing conductivity between them. In addition, since parts other than the solder ball electrodes 50 of the semiconductor device are covered by the guide 10, the fine needle electrodes 20 can be prevented from being contact with the parts other than the solder ball electrodes 50.