ELECTRIC CIRCUIT BOARD AND MANUFACTURE THEREOF

PURPOSE:To perform a process for manufacturing an electric circuit board which does not need the steps of etching and removing resist without using a metal foil bonding board by forming a conductive polymer pattern of oxidative polymerization catalyst having photoreactivity, and selectively electrol...

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Bibliographic Details
Main Authors NARUSE TSUTOMU, NATSUME KOYO, SAJI KAZUYOSHI, ONISHI YASUSHI
Format Patent
LanguageEnglish
Published 22.12.1995
Edition6
Subjects
APPARATUS THEREFOR
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
CHEMICAL SURFACE TREATMENT
CHEMISTRY
COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
COATING MATERIAL WITH METALLIC MATERIAL
COATING METALLIC MATERIAL
DIFFUSION TREATMENT OF METALLIC MATERIAL
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
ELECTROFORMING
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES
INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
METALLURGY
PRINTED CIRCUITS
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Summary:PURPOSE:To perform a process for manufacturing an electric circuit board which does not need the steps of etching and removing resist without using a metal foil bonding board by forming a conductive polymer pattern of oxidative polymerization catalyst having photoreactivity, and selectively electrolessly plating the pattern by utilizing reducibility of the polymer. CONSTITUTION:When the surface of an insulating board material provided with photoreactive polymerization catalyst such as iron chloride (III), etc., is, after it is irradiated by a light via a mask pattern, brought into contact with vapor or solution of monomer of conductive polymer such as pyrrole, the polymer is polymerized to be generated on the part in which a light is shielded. After the polymer pattern is dipped in palladium chloride liquid, it is electrolessly plated, and then metal is precipitated only on the pattern, and a metal circuit is formed along the pattern.
Bibliography:Application Number: JP19940156584