METHOD FOR MANUFACTURING MULTILAYER PRINTED WIRING BOARD

PURPOSE:To provide a method where the position deviation among a plurality of printed wiring boards for inner layer is extremely small in a multilayer printed wiring board. CONSTITUTION:The title method is provided with a process for providing foils 13a and 13b above and below combined printed wirin...

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Bibliographic Details
Main Authors TACHIBANA MASA, ANDO SEIJI, TANIZAKI TOSHIO
Format Patent
LanguageEnglish
Published 08.12.1995
Edition6
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Summary:PURPOSE:To provide a method where the position deviation among a plurality of printed wiring boards for inner layer is extremely small in a multilayer printed wiring board. CONSTITUTION:The title method is provided with a process for providing foils 13a and 13b above and below combined printed wiring boards 11a and 11b for inner layer and prepregs 12a-12c by eyelets 17a and 17b and a process for providing and laminating metal plates 16a and 16b at a part excluding the periphery of a fixing means, thus suppressing the melting and flow-out of resin constituting prepregs 12a-12c at the outer edge of metal plates 16a and 16b and the fixing parts between positioning holes 14a-14d and guide holes 15a-15f and retaining the relative position relationship between the printed wiring boards l la and l lb for inner layer.
Bibliography:Application Number: JP19940111234