SEMICONDUCTOR MANUFACTURE DEVICE AND SEMICONDUCTOR MANUFACTURE

PURPOSE:To provide a semiconductor manufacturing device and a semiconductor manufacturing method wherein it is detected in an extremely short time that a bonding tool comes into contact with a semiconductor part and movement of a bonding tool can be properly controlled. CONSTITUTION:A semiconductor...

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Bibliographic Details
Main Authors SUEMATSU MUTSUMI, OTANI KAZUMI
Format Patent
LanguageEnglish
Published 10.11.1995
Edition6
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:PURPOSE:To provide a semiconductor manufacturing device and a semiconductor manufacturing method wherein it is detected in an extremely short time that a bonding tool comes into contact with a semiconductor part and movement of a bonding tool can be properly controlled. CONSTITUTION:A semiconductor manufacturing device comprising a conductive bonding tool 15 for electrically connecting a lead 43 and an electrode 42 of a semiconductor component 41 and a driving means 16 for driving the bonding tool 15 in a direction of connecting the lead 43 and the electrode 42 has a detection means 17 which detects continuity of the bonding tool 15 and the electrode 42 and controls the driving means 16 on the basis of a signal from the detection means 15.
Bibliography:Application Number: JP19940091719