PRINTED WIRING BOARD AND MANUFACTURE OF PRINTED WIRING BOARD

PURPOSE:To enable high efficient manufacturing at a low cost, and maintain high performance and quality for a long term. CONSTITUTION:The title printed wiring board is provided with a substratum 1 for a printed wiring board, a conducting pattern part 2, and a plating part 3, which constitutes a mult...

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Bibliographic Details
Main Author ADACHI TAKEMA
Format Patent
LanguageEnglish
Published 27.10.1995
Edition6
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Summary:PURPOSE:To enable high efficient manufacturing at a low cost, and maintain high performance and quality for a long term. CONSTITUTION:The title printed wiring board is provided with a substratum 1 for a printed wiring board, a conducting pattern part 2, and a plating part 3, which constitutes a multilayered structure constituted of the following; a base layer 31 being in contact with the surface of the conducting pattern part 2, an upper base layer 33 of noble metal (Au or the like), and an intermediate layer 32 which is sandwiched by the layers 31 and 33 and composed of nickel with which nonconducting fine particles coexist. The electric potential of nickel forming the intermediate layer 32 is made nobler than that of gloss nickel forming the base layer 31.
Bibliography:Application Number: JP19940090677