SEMICONDUCTOR MANUFACTURING DEVICE

PURPOSE:To obtain a semiconductor manufacturing device where a zone temperature is surely controlled by a method wherein heat insulating pieces are provided between a reaction tube and a heater so as to partition a space between them into zones. CONSTITUTION:Heat insulating material is provided betw...

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Bibliographic Details
Main Authors IKEDA FUMIHIDE, NOMURA HISASHI
Format Patent
LanguageEnglish
Published 27.10.1995
Edition6
Subjects
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Summary:PURPOSE:To obtain a semiconductor manufacturing device where a zone temperature is surely controlled by a method wherein heat insulating pieces are provided between a reaction tube and a heater so as to partition a space between them into zones. CONSTITUTION:Heat insulating material is provided between a reaction tube 1 and a heater 11. The heat insulating material is composed of heat insulating pieces 13a which extend vertical to the center axis of the reaction tube 1 making a turn around the tube 1 and heat insulating pieces 13b which extend in parallel with the center axis of the reaction tube 1, and the heat insulating pieces 13a and the heat insulating pieces 13b are combined into a grid. The heat insulating pieces 13a are provided at positions corresponding to the zone boundaries. A space between the reaction tube 1 and the heater 11 are partitioned into sub-spaces by the heat insulating pieces 13a and 13b, gas on the surface of the heater 11 is restrained from making convection or heat is restrained from making advection through the sub-spaces. Therefore, each zone can be surely, thermally controlled. By this setup, a substrate can be controlled in temperature distribution by heating.
Bibliography:Application Number: JP19940087634