SOLDER BALL FEEDING JIG

PURPOSE:To increase the efficiency in the solder ball feeding work in relation to the title solder ball feeding jig used for the spare soldering step on a pad of a chip part such as LSI etc. CONSTITUTION:The title solder ball feeding jig is provided with a ball containing frame 1 encircled by a side...

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Bibliographic Details
Main Author YAMAUCHI KATSUTOSHI
Format Patent
LanguageEnglish
Published 03.10.1995
Edition6
Subjects
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
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Summary:PURPOSE:To increase the efficiency in the solder ball feeding work in relation to the title solder ball feeding jig used for the spare soldering step on a pad of a chip part such as LSI etc. CONSTITUTION:The title solder ball feeding jig is provided with a ball containing frame 1 encircled by a sidewall 1a, a mask 3 with a ball leading-in hole 3 insertion engaging ball 50 one by one contained in the solder ball containing frame 1 in backlash. state and a frame induction mechanism 2 slidably, holding the frame 1 so that the solder ball containing frame 1 may be shifted along the mask 3.
Bibliography:Application Number: JP19940044520