SEMICONDUCTOR DEVICE AND ITS MOUNTING STRUCTURE

• Main Authors: YONEDA YOSHIYUKI, SAKOTA EIJI, TSUJI KAZUTO
• Format: Patent
• Language: English
• Published: 26.09.1995
• Edition: 6
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

PURPOSE:To realize an ultrathin semiconductor device by making an opening larger than a semiconductor chip, applying a heat-resistant insulating film to the rear side of a die pad while covering the opening, and then mounting the semiconductor chip on the insulating film at the opening. CONSTITUTION:An opening 13 larger than a semiconductor chip 12 is made at the die pad part 11 of a lead frame 10 (Fig (a)). A heat-resistant resin film 14 of polyimide, for example, is then applied to the rear side of the lead frame 10 while covering the opening 13 (Fig. (b) and (c)). A semiconductor chip 12 is then connected with the inner lead 16 of the lead frame (Fig. (d) and (e)). The semiconductor chip 12, the wire bonding part, the inner lead 16, etc., are then molded airtightly of resin 18 to complete a semiconductor device or a package (Fig. (f) and (g)). This structure realizes an ultrathin semiconductor device excellent in wiring state.