LIQUID SUPPLY METHOD, ROTARY LIQUID SUPPLY UNIT AND ROTARY RESIST DEVELOPER

PURPOSE:To form a resist pattern with higher dimensional accuracy on the surface of a semiconductor water to be processed. CONSTITUTION:The rotary resist developer is provided with a proximate plate 2 and the capillary phenomenon of processing liquid is induced in the gap between the proximate plate...

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Main Authors HAMA SEIJI, TAMIYA YOICHIRO, MIZOGAMI KAZUAKI, CHIMURA MAKOTO, KANAI SHOJI, WATANABE KAZUYUKI, KANEMATSU MASAYOSHI
Format Patent
LanguageEnglish
Published 05.09.1995
Edition6
Subjects
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Summary:PURPOSE:To form a resist pattern with higher dimensional accuracy on the surface of a semiconductor water to be processed. CONSTITUTION:The rotary resist developer is provided with a proximate plate 2 and the capillary phenomenon of processing liquid is induced in the gap between the proximate plate 2 and a semiconductor wafer 6 when the processing liquid is fed to a resist film 6a in order to shorten the spreading time of the processing liquid on the resist film 6a thus thus smoothing the development. The proximate plate 2 is provided, in a region corresponding to the peripheral part of the semiconductor wafer 6, with a deceleration groove 2a1 in order to prevent adhesion of the processing liquid other than the surface to be processed. Only one nozzle 1 is employed and dedicated supply pipes are provided sequentially from the side close to the nozzle 1 while being coupled with a common supply pipe 7. Furthermore, means for feeding drying gas into the common supply pipe 7 and the nozzle 1 after supply of rinse liquid is provided in order to prevent dropping of the processing liquid onto the resist film 6 when the processing liquid is not supplied.
Bibliography:Application Number: JP19940025814