PRINTED BOARD

PURPOSE:To prevent design failure in board design wherein a CAD system is used. CONSTITUTION:Lands 9, 10 for soldering a part are enlarged wider than electrodes 4, 5 or a part outer shape range 6 of a part 3 to be mounted, and are printed in a printed board. Solder resists 12, 13 are applied to the...

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Bibliographic Details
Main Authors KATSUKI KENICHI, OZAWA KIYOSHI, TANPO HIROAKI, SEKINO YOSHIYUKI
Format Patent
LanguageEnglish
Published 22.08.1995
Edition6
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Summary:PURPOSE:To prevent design failure in board design wherein a CAD system is used. CONSTITUTION:Lands 9, 10 for soldering a part are enlarged wider than electrodes 4, 5 or a part outer shape range 6 of a part 3 to be mounted, and are printed in a printed board. Solder resists 12, 13 are applied to the lands 9, 10 making a solder effective region remain. For CAD design, the lands 9, 10 are regarded as a part outer shape range and a wiring pattern is designed. Then, designing is possible without causing design failure of shortcircuiting of a pattern 11 with the electrode 5 in a printed board. Since designing regarding the lands 9, 10 as a part outer shape range is possible, it is not required to set a macro arrangement forbidden region.
Bibliography:Application Number: JP19940036474