THERMOSETTING RESIN COMPOSITION

PURPOSE:To obtain the subject composition, excellent in compatibility between components and preservation stability and capable of promoting the curing reaction even at a relatively low temperature in a relatively short time and providing its cured product having excellent heat resistance, toughness...

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Bibliographic Details
Main Authors MARUYAMA ISAO, FUKUDA HIDEO, ITO ZENJI
Format Patent
LanguageEnglish
Published 08.08.1995
Edition6
Subjects
CHEMISTRY
COMPOSITIONS BASED THEREON
MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
METALLURGY
ORGANIC MACROMOLECULAR COMPOUNDS
THEIR PREPARATION OR CHEMICAL WORKING-UP
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Summary:PURPOSE:To obtain the subject composition, excellent in compatibility between components and preservation stability and capable of promoting the curing reaction even at a relatively low temperature in a relatively short time and providing its cured product having excellent heat resistance, toughness, adhesiveness and adhesion. CONSTITUTION:This thermosetting resin composition contains the following components (A), (B) and (C) at (95/5) to (10/90) weight composition ratio {(A)/[(B)+(C)]} of the component (A) to the components (B) and (C) and 0.3-20 equiv. ratio (B)/(C) of epoxy group in the component (B) to a functional group reactive with the epoxy group in the component (C): (A) a bisalkenyl-substituted nadimide without containing the functional group reactive with an epoxy resin, (B) the epoxy resin and (C) a compound having the functional group reactive with the epoxy resin and carbon-carbon double bond.
Bibliography:Application Number: JP19940022096