ELECTRONIC PART PACKAGE

• Main Authors: BENKATARAMU REDEI RAJIYU, INON DEGANI, BIYUNGU JIYOON HAN, TOOMASU DEIKUSON DATSUDERAA
• Format: Patent
• Language: English
• Published: 04.08.1995
• Edition: 6
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

PURPOSE: To reduce the stress and strain of a package caused by the differences between the thermal expansion coefficients of electronic parts and circuit parts by coupling to each other in only one-place the support elements for supporting the electronic parts, and by limiting to the vicinities of...