ELECTRONIC PART PACKAGE

PURPOSE: To reduce the stress and strain of a package caused by the differences between the thermal expansion coefficients of electronic parts and circuit parts by coupling to each other in only one-place the support elements for supporting the electronic parts, and by limiting to the vicinities of...

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Bibliographic Details
Main Authors BENKATARAMU REDEI RAJIYU, INON DEGANI, BIYUNGU JIYOON HAN, TOOMASU DEIKUSON DATSUDERAA
Format Patent
LanguageEnglish
Published 04.08.1995
Edition6
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:PURPOSE: To reduce the stress and strain of a package caused by the differences between the thermal expansion coefficients of electronic parts and circuit parts by coupling to each other in only one-place the support elements for supporting the electronic parts, and by limiting to the vicinities of the only one-place of the supporting elements the relative lateral movements of the electronic parts to a circuit board. CONSTITUTION: On a circuit board 200, integrated circuit chips 300 are mounted by local metallic layers 243, 244, 245. The upper surfaces of the local metallic layers 243, 244, 245 are coated with local supporting layers 253, 254, 255. A bonding layer 304 is formed only on the central portion of the local supporting layer 254 to thereby prevent the movements of the integrated circuit chips 300 in the course of their assembling processes which are performed in the directions of the side surfaces of the layers 243, 244, 245. The bonding layer 304 is made of epoxy resin to be cured by heating after the integrated circuit chips 300 are disposed properly on all the local supporting layers 253, 254, 255. Also, the integrated circuit chips 300 are confined in a hard cover 500 by a soft gel medium 400 to capsule the chips 300.
Bibliography:Application Number: JP19940332860