IC CARD AND ITS MANUFACTURE

PURPOSE:To eliminate generation of unevenness on the surface of a laminated product after press lamination, by a method wherein a reinforcing plate from which a part corresponding to at least a part of a plurality of spheres surrounding electronic parts mounting part is removed through blanking is p...

Full description

Saved in:
Bibliographic Details
Main Author ADACHI TAKEMA
Format Patent
LanguageEnglish
Published 18.07.1995
Edition6
Subjects
BASIC ELECTRIC ELEMENTS
BOOK COVERS
BOOKBINDING
CALCULATING
COMPUTING
COUNTING
DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDEDFOR
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
FILES
HANDLING RECORD CARRIERS
LOOSE LEAVES
MOVABLE-STRIP WRITING OR READING APPARATUS
PERFORMING OPERATIONS
PHYSICS
PRESENTATION OF DATA
PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITYFEATURES
PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOTOTHERWISE PROVIDED FOR
RECOGNITION OF DATA
RECORD CARRIERS
SEMICONDUCTOR DEVICES
SPECIAL PRINTED MATTER
TRANSPORTING
Online AccessGet full text

Cover

More Information
Summary:PURPOSE:To eliminate generation of unevenness on the surface of a laminated product after press lamination, by a method wherein a reinforcing plate from which a part corresponding to at least a part of a plurality of spheres surrounding electronic parts mounting part is removed through blanking is provided. CONSTITUTION:In a circuit board 10, a conductor circuit 11 which is formed by removing selectively copper foils stuck together through, for example, an ester type thermoplastic adhesive agent by etching and a letter pattern 12 which expresses a product number on the upper part and right of the conductor circuit 11 are provided on the surface. In an adhesive agent sheet 20, circular holes 21a, 21b, 21c which correspond to a sphere containing chip condenser mounting pad 11a and semiconductor IC chip mounting pads 11b, 11c and a square hole 21d corresponding to four pieces of film condenser mounting pads 11d are provided. In a reinforcing plate 30, blanked hole by a press in a fixed position with the circuit board 10, that is, circular holes 31a, 31b, 31c, 31e and a small circular hole 32 are provided.
Bibliography:Application Number: JP19930346679