PRODUCTION OF PRINTED WIRING BOARD

• Main Authors: TANNO SEIKICHI, TSUCHIYA KATSUNORI
• Format: Patent
• Language: English
• Published: 23.06.1995
• Edition: 6
• Subjects: APPARATUS SPECIALLY ADAPTED THEREFOR; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CINEMATOGRAPHY; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; ELECTROGRAPHY; HOLOGRAPHY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; MATERIALS THEREFOR; ORIGINALS THEREFOR; PHOTOGRAPHY; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES; PHYSICS; PRINTED CIRCUITS

PURPOSE:To provide a production method of a printed wiring board of using an electroless plating method by which little environmental pollution is caused and high accuracy, good heat resistance against soldering and resistance against thermal shock are obtd. CONSTITUTION:The method includes the following steps (1) to (3). (1) An insulating substrate is subjected to electroless copper plating, on which a photosensitive resin compsn. layer is formed. The photosensitive resin compsn. contains (a) a photopolymerizable unsatd. compd. obtd. by the reaction of a univalent satd. and/or unsatd. isocyanate compd. with an unsatd. compd. obtd. by additional reaction of a novolac epoxy resin and unsatd. carboxylic acid, and (b) 2-benzyl-2- dimethylamino-1-(4-morpholinophenyl)-butanone-1. (2) The photosensitive resin layer is irradiated with active rays to form an image and developed with a developer mixed with water or an org. solvent except halogen-base org. solvent so that a pattern of the photosensitive resin compsn. is formed on the surface of the substrate. (3) The pattern is formed using a resist for plating and the wiring pattern and/or connection holes are formed by electroless plating.