POLISHING APPARATUS FOR SEMICONDUCTOR SUBSTRATE

PURPOSE:To provide a polishing apparatus for semiconductor substrate in which production of bubbles is prevented at the time of stretching a polishing cloth. CONSTITUTION:The polishing apparatus comprises a turn table 10, a polishing cloth 12 secured onto the turn table 10, and a rotating polishing...

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Bibliographic Details
Main Authors ARIMOTO YOSHIHIRO, SUGIMOTO FUMITOSHI
Format Patent
LanguageEnglish
Published 02.06.1995
Edition6
Subjects
BASIC ELECTRIC ELEMENTS
DRESSING OR CONDITIONING OF ABRADING SURFACES
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
GRINDING
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
PERFORMING OPERATIONS
POLISHING
SEMICONDUCTOR DEVICES
TRANSPORTING
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Summary:PURPOSE:To provide a polishing apparatus for semiconductor substrate in which production of bubbles is prevented at the time of stretching a polishing cloth. CONSTITUTION:The polishing apparatus comprises a turn table 10, a polishing cloth 12 secured onto the turn table 10, and a rotating polishing head 14, wherein a semiconductor substrate 20 to be polished is secured to the polishing head 14 and then polished while dripping an abrasive onto the polishing cloth 12. The polishing cloth 12 is divided into a plurality of insular polishing cloths secured, respectively, to the turn table 10.
Bibliography:Application Number: JP19940047129