PRINTED WIRING BOARD AND MANUFACTURE THEREOF

PURPOSE:To provide a printed wiring board and a method for the manufacture thereof wherein crosstalk is reduced and the mounting density at its ends connected to connectors and boards is increased. CONSTITUTION:A plurality of printed boards 11, 12 are bonded together with an insulating layer 15 in-b...

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Bibliographic Details
Main Author OMINATO TADANORI
Format Patent
LanguageEnglish
Published 19.05.1995
Edition6
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Summary:PURPOSE:To provide a printed wiring board and a method for the manufacture thereof wherein crosstalk is reduced and the mounting density at its ends connected to connectors and boards is increased. CONSTITUTION:A plurality of printed boards 11, 12 are bonded together with an insulating layer 15 in-between. A plurality of signal lines 13, 13 are placed at a specified interval on the surface 11a of one 11 of the printed boards 11, 12 opposing to the other 12. A plurality of ground lines 14, 14 are placed on the surface 12a of the other printed board 12 opposing to the one 11 in such a way that the ground lines and signal lines are alternately placed. The ends of the resultant printed wiring board are separated from each other so that the printed boards 11, 12 can be isolated from each other.
Bibliography:Application Number: JP19930277148