SEMICONDUCTOR PACKAGE MOUNTING SUBSTRATE

PURPOSE:To obtain excellent heat-radiating property, and also to prevent impairing of the degree of freedom of the wiring of a conductor circuit on a substrate. CONSTITUTION:An EPROM 2a is provided in the center part of a semiconductor package 2, and a heat radiating palte 2e is provided on the lowe...

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Bibliographic Details
Main Authors DEMURA AKIHIRO, TAKAHASHI SHINJI
Format Patent
LanguageEnglish
Published 25.03.1994
Edition5
Subjects
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
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Summary:PURPOSE:To obtain excellent heat-radiating property, and also to prevent impairing of the degree of freedom of the wiring of a conductor circuit on a substrate. CONSTITUTION:An EPROM 2a is provided in the center part of a semiconductor package 2, and a heat radiating palte 2e is provided on the lower part of the EPROM 2a. A pair of flat patterns 3b and 3c are formed on the position corresponding to the heat radiating plate 2e on both surfaces of a substrate 3. A heat radiating plate 2e is closely arranged on the flat pattern 3b on the upper surface of the substrate. Both patterns 3b and 3c are connected through a plurality of plated through holes 3d. According to this constitution, the semiconductor package 2, provided with a heat-radiating plate 2e, can be face-up mounted on the substrate 3.
Bibliography:Application Number: JP19920236065